Conventional 3D printing builds parts one slice at a time.
We print the whole part all at once.
Every commercial printer in production today is layer-bound. Throughput is set by the time it takes to traverse Z, layer after layer. Hours per part.
MAV projects calibrated light into a volume of resin. Where the integrated dose crosses the cure threshold, material solidifies — everywhere, simultaneously. The whole part appears in a single exposure.
Minutes, not hours.
Most 3D printing systems take hours to produce a part, layer-by-layer. MAV projects light images into a rotating vial of resin to form parts almost instantly, with no layer lines.
Engineering-grade parts, not demos.
Conventional 3D printing is constrained to thin, low-viscosity resins. MAV prints with materials up to 20× more viscous — the chemistries that produce structurally sound, end-use parts.
Volumetric cure also removes the layer-adhesion failure mode, which is what disqualifies most 3D-printed parts from real load paths today.
Layerless by construction.
Between layers are where conventional 3D-printed parts fail under load. MAV creates layerless, monolithic parts that are stronger and more resilient.
Layer lines from traditional 3D printing aren’t removable, even with polishing or vapor smoothing. MAV prints optically clear parts, with no layer lines.
Print directly over electronics and metals.
Volumetric exposure cures the resin around an inclusion in the same single illumination it cures the bulk part. No nozzle has to traverse the surface; no print head has to make contact. MAV is the only additive technology that can print directly over electronics or metals.
The inclusion sits in the resin volume; cured polymer forms around it. Sensors, antennas, magnets, board assemblies — components that would have been added in a second step on a layer printer can be encapsulated in the print itself.
World-class engineering and business expertise.
Co-founded by Prof. Robert Shepherd (Cornell, scaled volumetric printing 30×), Aaron Pempel (CEO, former Nike GM), and Prof. T.J. Wallin (MIT, 35+ patents).
Meet the team
